Design in electronics packaging

We provide design in electronics packaging, from new products to revised layouts and device miniaturisation. Technologies include, WLCSP, plastic lead-frame,  Power, Hi-Rel Ceramic, Metal-can,  custom MEMs, Thick film and MCM/SIP. We can work with the client to provide a solution and a manufacturing process flow. Our knowledge of both process and technology allows us to  provide a solutions that can minimise negative effects on overall product performance. MEMs products are particularity sensitive to environmental and process induced conditions, the design and process flow being very important considerations.

OPServices design services can provide access to the fully patented CLAM-LP™ & WLPoP™ technologies. These innovative and cost-effective designs provide solutions to EMI shielding and heat management at component level.

CLAM-LP™ is built upon industry-standard QFN processing techniques,  however additionally provides;

  • Integrated Electro-Magnetic (EMI) shield.
  • Top & bottom heatsink.
  • Integrated passives – e.g. Inductive coil & meanders.
  • Integrated antenna.
  • Optical lens /filter mount – e.g. For Image Sensor or Micro-Displays

Target markets and applications;

  • RF Power Amplifiers and Front-End Modules (FEM)
  • Power Management
  • Wireless Connectivity
  • Image Sensors & Micro Displays
  • MEMS
  • “Fan-in” and “Fan-out” Chip-Scale Packaging
  • Biometrics
  • Power Semiconductors IGBT, Power MOSFET etc.

WLPoP™ (Wafer-Level Chip-Scale Package-on-Package), allows the possibility of nesting / stacking multiple WLCSP’s in a single chip-scale outline. The technology has been developed to uniquely facilitate near-term, cost-effective stacking of existing chips at the chip-scale without the protracted timeline / risk and high investments levels needed for Thru-Silicon-Vias (TSV) or embedded die.
 
Target markets and applications;

  • SiP / Modules for Mobile phone (FEM)
  • “Wearables”
  • Power Management
  • “Fan-in” and “Fan-out Chip-scale packaging
  • Wireless Connectivity and IoT
  • Image Sensors & Micro Displays
  • MEMS
  • Biometrics
  • Power Semiconductors

Contact us for more information.