OPServices design services  now have access to the full patent (US Patent No. 7 880 282 February 1st 2011), CLAM-LP™ & WLPoP™ shielded semiconductor packaging technologies. These innovative and cost-effective designs provide solutions to EMI shielding and heat management at component level.

shielded QFN

(Image courtesy of rfmod.com)

 

CLAM-LP™ is built upon industry-standard QFN processing techniques, however additionally provides;

  • Integrated Electro-Magnetic (EMI) shield.
  • Top & bottom heatsink.
  • Integrated passives – e.g. Inductive coil & meanders.
  • Integrated antenna.
  • Optical lens /filter mount – e.g. For Image Sensor or Micro-Displays

Target markets and applications;

  • RF Power Amplifiers and Front-End Modules (FEM)
  • Power Management
  • Wireless Connectivity
  • Image Sensors & Micro Displays
  • MEMS
  • “Fan-in” and “Fan-out” Chip-Scale Packaging
  • Biometrics
  • Power Semiconductors IGBT, Power MOSFET etc.

WLPoP™ (Wafer-Level Chip-Scale Package-on-Package), allows the possibility of nesting / stacking multiple WLCSP’s in a single chip-scale outline. The technology has been developed to uniquely facilitate near-term, cost-effective stacking of existing chips at the chip-scale without the protracted timeline / risk and high investments levels needed for Thru-Silicon-Vias (TSV) or embedded die.
 
Target markets and applications;

  • SiP / Modules for Mobile phone (FEM)
  • “Wearables”
  • Power Management
  • “Fan-in” and “Fan-out Chip-scale packaging
  • Wireless Connectivity and IoT
  • Image Sensors & Micro Displays
  • MEMS
  • Biometrics
  • Power Semiconductors