Electronics Packaging Design

We have experienced electronics packaging design specialists who have worked for major semiconductor manufacturers including Samsung, CSR and Nokia.

OPServices design services  now have access to the full patent (US Patent No. 7 880 282 February 1st 2011), CLAM-LP™ & WLPoP™ shielded semiconductor packaging technologies. These innovative and cost-effective designs provide solutions to EMI shielding and heat management at component level.

Electronics-Package-Design

CLAM-LP

The CLAM-LP™ is built upon industry-standard QFN processing techniques,  however additionally provides;

  • Integrated Electro-Magnetic (EMI) shield.
  • Top & bottom heatsink.
  • Integrated passives – e.g. Inductive coil & meanders.
  • Integrated antenna.
  • Optical lens /filter mount – e.g. For Image Sensor or Micro-Displays

Target markets and applications;

  • RF Power Amplifiers and Front-End Modules (FEM)
  • Power Management
  • Wireless Connectivity
  • Image Sensors & Micro Displays
  • MEMS
  • “Fan-in” and “Fan-out” Chip-Scale Packaging
  • Biometrics
  • Power Semiconductors IGBT, Power MOSFET etc.

electronics packaging design

WLPoP(Wafer-Level Chip-Scale Package-on-Package)

WLPoP™ (Wafer-Level Chip-Scale Package-on-Package), allows the possibility of nesting / stacking multiple WLCSP’s in a single chip-scale outline. The technology has been developed to uniquely facilitate near-term, cost-effective stacking of existing chips at the chip-scale without the protracted timeline / risk and high investments levels needed for Thru-Silicon-Vias (TSV) or embedded die.
 
Target markets and applications;

  • SiP / Modules for Mobile phone (FEM)
  • “Wearables”
  • Power Management
  • “Fan-in” and “Fan-out Chip-scale packaging
  • Wireless Connectivity and IoT
  • Image Sensors & Micro Displays
  • MEMS
  • Biometrics
  • Power Semiconductors

Electronics-Package-Design

SiP (System in Package)

Whether wishing transfer to an offshore facility or returning to an onshore model, we can manage all process and qualification activities. We have assisted  defence, aerospace, automotive and consumer companies with technology transfers and production management. We have also worked with SMEs and technology start-up companies with projects ranging from single process outsourcing to providing a full turnkey production. We have supported global clients from United Kingdom, United States of America, Japan, France and Switzerland. We have worked with numerous contract electronics manufacturing providers in locations across Europe, South-East Asia and the United States of America.

Electronics-Package-Design

Contract Electronics Manufacturing

Whether wishing transfer to an offshore facility or returning to an onshore model, we can manage all process and qualification activities. We have assisted  defence, aerospace, automotive and consumer companies with technology transfers and production management. We have also worked with SMEs and technology start-up companies with projects ranging from single process outsourcing to providing a full turnkey production. We have supported global clients from United Kingdom, United States of America, Japan, France and Switzerland. We have worked with numerous contract electronics manufacturing providers in locations across Europe, South-East Asia and the United States of America.

Electronics-Package-Design

Thick-Film Modules

Whether wishing transfer to an offshore facility or returning to an onshore model, we can manage all process and qualification activities. We have assisted  defence, aerospace, automotive and consumer companies with technology transfers and production management. We have also worked with SMEs and technology start-up companies with projects ranging from single process outsourcing to providing a full turnkey production. We have supported global clients from United Kingdom, United States of America, Japan, France and Switzerland. We have worked with numerous contract electronics manufacturing providers in locations across Europe, South-East Asia and the United States of America.

Thick-film Module

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GLOBAL OFFICES

UNITED KINGDOM

UK & Ireland

SWITZERLAND

Mainland Europe

NORTH AMERICA

U.S.A & Canada

GLOBAL OFFICES

UNITED KINGDOM

UK & Ireland

SWITZERLAND

Mainland Europe

NORTH AMERICA

U.S.A & Canada